DSPIC33EP512MU814-I/PL

DSPIC33EP512MU814-I/PL

Part Number: DSPIC33EP512MU814-I/PL

Manufacturer: Microchip Technology

Description: IC MCU 16BIT 512KB FLASH 144LQFP

Shipped from: Shenzhen/HK Warehouse

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DSPIC33EP512MU814-I/PL Description

A 70 MIPS dsPIC® DSC core with integrated DSP and improved on-chip peripherals are at the heart of Microchip’s dsPIC33E family of digital signal controllers (DSCs). These DSCs let engineers create high-precision motor control systems with improved efficiency, less noise, greater operating distance, and a longer service life. They are versatile enough to manage DC motors, synchronous motors, AC induction motors, and stepper motors. These gadgets excel in high-performance, multipurpose settings as well.

Features

Operating Conditions

  • DC to 60 MIPS at 3.0V to 3.6V and -40 to +125 degrees Celsius.
  • DC to 70 MIPS at 3.0V to 3.6V and -40 to +85 degrees Celsius.

Core: 16-Bit dsPIC33E/PIC24E CPU

  • The structure that makes good use of code (C and Assembly).
  • Accumulators of 40 bits each in width.
  • Dual Data Fetch, Single-Cycle (MAC/MPY).
  • Hardware-Based Divider for Mixed-Signal MUL with a Single Cycle.
  • Support for 32-Bit Multiplication.

Clock Management

  • Code-efficient architecture (C and Assembly).
  • A 40-bit wide accumulator.
  • Single-Cycle (MAC/MPY) Dual-Data-Fetch.
  • Cycle-Sparing Hardware-Based MUL Divider for Mixed-Signal Operations.
  • The ability to multiply using 32 bits.

Power Management

  • Modes of Low Power Consumption (Sleep, Idle, Doze).
  • Power-on reset and brown-out reset combined.
  • Dynamic Current of 1 mA/MHz (typical).
  • IPD Current at 60 mA (typical).

Advanced Analog Features

Device Overview

● ICSP Pins

When connecting an ICSP connector to ICSP pins on a device, keeping the trace length as low as possible is highly recommended. A series resistor with a value of a few tens of Ohms and no more than 100 Ohms is advised if an ESD event is anticipated for the ICSP connector. Adding pull-up resistors, series diodes, or capacitors to the PGECx or PGEDx pins will cause communication problems between the device and the programmer or debugger.

If the application necessitates discrete components, they should be taken out of the circuit before programming and testing. For alternative guidance on capacitive loading limitations and pin input voltage high (VIH) and input low (VIL) specifications, check the AC/DC characteristics and timing requirements section of the relevant device’s Flash programming specification.

● External Oscillator Pins

Numerous DSCs have choices for at least two oscillators: a primary oscillator operating at a high frequency and a secondary oscillator operating at a lower frequency.

The oscillator circuit should be mounted on the side of the board parallel to the gadget. A maximum distance of 12 millimeters (1 inch) should be left between the oscillator circuit and the pertinent oscillator pins. The load capacitors should be placed next to the oscillator on the same side of the circuit board as the oscillator. A grounded copper pour could be used to enclose the oscillator circuit in order to separate it from the nearby circuits. The MCU ground should be directly connected to the grounded copper pour. You shouldn’t ever run any signal or power traces within the ground pour. You should also avoid placing any traces on the side of the board that contains the crystal if you’re using a board with two sides.

● Oscillator Value Conditions on Device Start-up

Let’s say the device’s PLL is turned on and set up to be the device startup oscillator.  In that situation, in order to meet the device PLL start-up requirements, the highest oscillator source frequency must be restricted to 3 MHz FIN 5.5 MHz. This ensures that the PLL will start up properly. Therefore, if the external oscillator frequency is outside of this range, the application will have to initiate the FRC mode at first. The device’s operating speed will be compromised if the PLL settings are left in their default state after a POR because the oscillator frequency will fall outside this range. The application firmware can set the PLL SFRs, CLKDIV, and PLLDBF to the proper values after the device has been powered on, and it can then switch the clock source to the Oscillator plus the PLL. Please take note that the device’s Configuration Word must be updated to enable the clock-switching feature.

● CPU

The CPU is based on a modified Harvard architecture that expands to 16 bits of data and features an extensive digital signal processing instruction set. The CPU uses 24-bit instruction words with an opcode field of varying length. The PC can access user-assigned memory locations up to 4M in size using its full width of 24 bits.

The ability to prefetch instructions before they are executed is crucial for keeping execution speeds stable and ensuring predictable results. Except for control-flow instructions, the double-word move (MOV.D) instruction, PSV accesses, and the table instructions, most of the instructions run in a single cycle. The DO and REPEAT instructions provide for overhead-free, loop-based program construction that can be interrupted at any time.

● Registers

In the developer’s ideal concept, each device has sixteen 16-bit registers. Any operational registers can perform data, Address, and Address Offset functions. The W15 working register is utilized as a call and interrupt stack pointer. One can quickly save and restore their context by utilizing only one POP.S or PUSH.S instruction on the working registers W0 through W3 and selected bits from the STATUS register’s shadow registers.

● Instruction Set

Instructions in the dsPIC33EPXXXMU806/810/814 instruction set can be categorized into the microcontroller (MCU) and digital signal processor (DSP). The MCU class of instructions is available in the PIC24EPXXX(GP/GU)810/814 instruction set; however, the DSP class is not. The architecture’s integration of these two types of instructions is smooth, and they both run on the same execution unit. The instruction set was developed with the highest possible efficiency of C compilers in mind and featured various addressing modes.

● Data Space Addressing

The Base Data Space is divided into two sections, X and Y data memory, and can be addressed in either 32K words or 64K bytes. Separate AGUs are responsible for generating addresses for each portion of memory (AGU). Only the X memory AGU is used for the MCU class of instructions, which treats the entire memory map as a single linear data space. Specific DSP instructions on dsPIC33EPXXX(GP/MC/ MU)806/810/814 devices utilize the X and Y AGUs to facilitate dual operand reads. This results in a partitioned data address space. Devices vary in where they set the X and Y data space limit.

Conclusion

The Base Data Space is divided into two sections, X and Y data memory, and can be addressed in either 32K words or 64K bytes. Separate AGUs are responsible for generating addresses for each portion of memory (AGU). Only the X memory AGU is used for the MCU class of instructions, which treats the entire memory map as a single linear data space. Certain DSP instructions on dsPIC33EPXXX(GP/MC/ MU)806/810/814 devices utilize the X and Y AGUs to facilitate dual operand reads. This results in a partitioned data address space. Devices vary in where they set the X and Y data space limits.

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