EP4CE55F23C8N

EP4CE55F23C8N

Part Number: EP4CE55F23C8N

Manufacturer: Intel

Description: IC FPGA 324 I/O 484FBGA

Shipped from: Shenzhen/HK Warehouse

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Technical Specifications of EP4CE55F23C8N

Datasheet  EP4CE55F23C8N datasheet
Category Integrated Circuits (ICs)
Family Embedded – FPGAs (Field Programmable Gate Array)
Manufacturer Altera
Series Cyclone? IV E
Part Status Active
Number of LABs/CLBs 3491
Number of Logic Elements/Cells 55856
Total RAM Bits 2396160
Number of I/O 324
Number of Gates
Voltage – Supply 1.15 V ~ 1.25 V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BGA
Supplier Device Package 484-FBGA (23×23)

EP4CE55F23C8N Description

When Cyclone IV devices are integrated into a system, the system determines the parameters against which they are evaluated for rating. You must take into consideration the operating requirements outlined in this chapter to keep the performance and dependability of Cyclone IV devices at their highest possible level. Devices based on the Cyclone IV platform can be purchased in commercial, industrial, extended industrial, and automotive grades.

Cyclone IV E devices provide speed grades of –6 (the fastest), –7, –8, –8L, and –9L for commercial devices, –8L speed grades for industrial devices, and –7-speed grades for extended industrial and automotive devices. For commercial devices, Cyclone IV GX offers the –6 (fastest) speed grade, as well as –7 and –8-speed grades; for industrial devices, the –7-speed grade is available.

There are two core voltage options available for the Cyclone IV E devices: 1.0 and 1.2 V. A prefix of ‘L’ is added to the speed grade of Cyclone IV E devices when the core voltage is 1.0 V.

Product Technical Specifications

EU RoHS Compliant
ECCN (US) 3A991
Part Status Active
HTS 8542.39.00.01
Automotive No
PPAP No
Family Name Cyclone® IV E
Process Technology 60nm
User I/Os 324
Number of I/O Banks 8
Operating Supply Voltage (V) 1.2
Logic Elements 55856
Number of Multipliers 154 (18×18)
Program Memory Type SRAM
Embedded Memory (Kbit) 2340
Total Number of Block RAM 260
Device Logic Units 55856
Number of Global Clocks 20
Device Number of DLLs/PLLs 4
JTAG Support Yes
Dedicated DSP 154
PCIe 1
Programmability Yes
Programmability Support No
Number of Look-up Table Input 4
Copy Protection No
In-System Programmability No
Speed Grade 8
Differential I/O Standards B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL
Single-Ended I/O Standards LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
External Memory Interface DDR SDRAM|DDR2 SDRAM|QDRII+SRAM
Minimum Operating Supply Voltage (V) 1.16
Maximum Operating Supply Voltage (V) 1.24
I/O Voltage (V) 1.2|1.5|1.8|2.5|3|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Packaging Tray
Tradename Cyclone
Mounting Surface Mount
Package Height 1.75
Package Width 23
Package Length 23
PCB changed 484
Standard Package Name BGA
Supplier Package FBGA
Pin Count 484
Lead Shape Ball

Absolute Maximum Ratings

are used to define the most extreme conditions that can be encountered while operating Cyclone IV devices. The values were derived from the results of experiments carried out with the device and theoretical modeling of the mechanisms that cause breakage and damage. Under these circumstances, one should not assume that the device is working correctly in its intended capacity.

Maximum Allowed Overshoot or Undershoot Voltage

During transitions, the magnitude of input signals may overshoot to the voltage or undershoot to –2.0 V for less than 20 nanoseconds and currents with a magnitude of fewer than 100 milliamperes (mA).

DC Characteristics

In this part, the specifications for Cyclone IV devices are broken down into categories like I/O leakage current, pin capacitance, on-chip termination (OCT) tolerance, and bus hold. The Circulating Current of Supply The minimum current that must be pulled from the power supply pins is known as the device supply current requirement, and it can serve as a point of reference for planning the amount of power required. It is recommended that you use the early power estimator (EPE) that is based on Excel to obtain the supply current estimations for your design because these currents fluctuate widely depending on the resources utilized.

Bus Hold

After the source driving, it has either entered the high impedance state or been removed entirely, and the bus-hold will keep its last valid logic state. Within user mode, a switch may be activated to enable bus hold for each individual I/O pin. When in configuration mode, the hold function for the bus is always turned off.

Schmitt Trigger Input

Cyclone IV devices include support for Schmitt trigger input on various pins, including TDI, TMS, TCK, nSTATUS, nCONFIG, nCE, CONF DONE, and DCLK. Hysteresis is introduced to the input signal through a Schmitt trigger, which results in better noise immunity, particularly for signals with a slow edge rate.

I/O Standard Specifications

The tables that follow provide information regarding the input voltage sensitivity (VIH and VIL), output voltage (VOH and VOL), and current driving characteristics (IOH and IOL) for the various I/O standards that Cyclone IV devices can handle.

Power Consumption

To get an estimate of the power required for a design, use the following methods:

  • The EPE uses Excel.
  • Use of the Quartus II PowerPlay power analyzer.

Before creating the device, the interactive, Excel-based EPE is utilized to gain a magnitude estimate of the device’s power output. After the place-and-route process is finished, the Quartus II PowerPlay power analyzer can produce more accurate estimations by considering the design’s particulars. The PowerPlay power analyzer can use a combination of user-entered, simulation-derived, and estimated signal activity, which, when combined with precise circuit models, can result in very accurate power estimates.

Switching Characteristics

This section details Cyclone IV core performance parameters and peripheral blocks for commercial-grade devices. Depending on the situation, these traits might be marked as either Preliminary or Final.

The outcomes of simulations, data from the process, and any other known parameters are used to provide preliminary characteristics. In the top-right-hand corner of each table is the word “Preliminary,” inscribed in italics.

The final statistics have been determined based on the characterization and testing of natural silicon. These statistics represent the device’s actual performance when subjected to the worst-case scenario for the silicon process, voltage, and junction temperature. The tables that have been finalized do not include any designations.

Periphery Performance

This part discusses the performance of the peripherals, including high-speed I/O and the interface for external memory. I/O performance supports various system interfaces, including the high-speed I/O interface, the external memory interface, and the PCI/PCI-X bus interface, among others. I/Os that adhere to the SSTL-18 Class I termination standard can reach the maximum DDR2 SDRAM interface rates specified. I/Os that adhere to general-purpose I/O standards, such as 3.3-, 3.0-, 2.5-, 1.8-, or 1.5-LVTTL/LVCMOS, can achieve a typical interface frequency of 200 MHz even when a load of 10 pF is present.

I/O Timing

To determine the timing of I/O operations, use the following methods:

  • The Excel-Based I/O Timing
  • The Quartus II Timing Analyzer

I/O timing based on Excel delivers pin timing performance for every device density and speed grade. In most cases, the data is utilized before the construction of the FPGA to estimate the timing budget as a component of the link timing analysis. After the place-and-route phase of the design is over, the Quartus II timing analyzer delivers I/O timing data that is more exact and precise since it is based on the particulars of the design.

Conclusion

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