STM32F103VDT6 ARM Microcontrollers

Technical Specifications of STM32F103VDT6

Datasheet	STM32F103VDT6 datasheet
Category	Integrated Circuits (ICs)
Family	Embedded – Microcontrollers
Manufacturer	STMicroelectronics
Series	STM32 F1
Packaging	Tray
Part Status	Active
Core Processor	ARM? Cortex?-M3
Core Size	32-Bit
Speed	72MHz
Connectivity	CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
Peripherals	DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O	80
Program Memory Size	384KB (384K x 8)
Program Memory Type	FLASH
EEPROM Size	–
RAM Size	64K x 8
Voltage – Supply (Vcc/Vdd)	2 V ~ 3.6 V
Data Converters	A/D 16x12b; D/A 2x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	100-LQFP
Supplier Device Package	*

STM32F103VDT6 Introduction

“The STM32F103VDT6 Complete Guide is a great place to start if you’re interested in learning how to program microcontrollers. This in-depth guide will teach you everything you need to know to start making use of this powerful microcontroller immediately in your own projects.”

Description

The STM32F103xD, STM32F103xC, and STM32F103xE are members of the STM32F103x performance line, containing a 72 MHz Arm® Cortex®-M3 32-bit RISC CPU, high-speed embedded memory, and a wide range of upgraded I/Os and peripherals connected via two APB buses. The devices also feature up to two I2Cs, three SPIs, two I2Ss, 1 SDIO, 5 USARTs, a CAN, and a USB, in addition to the three 12-bit ADCs, two PWM timers, and four general-purpose 16-bit timers.

The STM32F103xC/D/E series of high-performance lines may operate normally at voltages between 2.0 and 3.6 V and temperatures between -40 and +105 °C. Complete energy-saving options allow for the creation of power-efficient apps. The STM32F103xC/D/E high-density performance line microcontroller family is well-suited for many uses thanks to these characteristics. Motor drives, application control, medical and handheld equipment, personal computer and gaming peripherals, global positioning system platforms, industrial applications, programmable logic controllers, inverters, printers, scanners, alarm systems, video intercom, and heating, ventilation, and air conditioning (HVAC) systems are just a few examples.

STM32F103VDT6 Features

Core: Arm® 32-bit Cortex®-M3 CPU

• The maximum frequency of 72 MHz; performance of 1.25 DMIPS/MHz (Dhrystone 2.1) while in a 0-wait state for memory access.
• Multiplication and division with a single cycle in the hardware.

Memories

• Flash memory ranges from 256 to 512 kilobytes in size.
• SRAM capacities of up to 64 kilobytes.
• A controller for flexible static memory that has four chip selects. Memory types include Compact Flash, SRAM, PSRAM, and NOR, as well as NAND are supported.
• LCD parallel interface, 8080/6800 modes.

Clock, reset, and supply management

• Application supply and I/Os with a voltage range of 2.0 to 3.6 V; POR, PDR, and configurable voltage detector (PVD).
• 4-to-16 MHz crystal oscillator.
• Internal RC that has been factory-tuned to 8 MHz.
• RC with an internal frequency of 40 kHz and calibration.
• Oscillator for the RTC running at 32 kHz, including calibration.

Device overview

Six different package variants are available for the devices that belong to the STM32F103xC/D/E high-density performance line family. The pin count ranges from 64 to 144. The peripherals that come with the device vary according to the device you go with; however, the description that follows provides an overview of the entire range of peripherals that are available for this family of products.

Full Compatibility Throughout The Family

The STM32F103xC/D/E family is comprehensive, with members that are entirely compatible with one another in terms of pin-to-pin, software, and feature compatibility. The STM32F103x4 and STM32F103x6 are referred to as low-density devices in the reference manual. On the other hand, the STM32F103x8 and STM32F103xB are described as medium-density devices, and the STM32F103xD, STM32F103xC, and STM32F103xE are high-density devices. The datasheets for the low-density and high-density devices are the STM32F103x4/6 and STM32F103xC/D/E series. These devices are extensions of the medium-density devices defined in the STM32F103x8/B series.

Low-density devices have fewer features, including less RAM, less Flash memory, fewer timers, and fewer peripherals. High-density devices feature increased capacity for both Flash memory and RAM and extra peripherals such as SDIO, FSMC, I2S, and DAC. However, they are still completely compatible with the devices included in the rest of the family. Drop-in replacements for the STM32F103x8/B devices, the STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD, and STM32F103xE let the user experiment with alternative memory densities and provide a wider degree of freedom during the development cycle. All STM32F101x access line devices and STM32F102xx USB access line devices are compatible with the STM32F103xx performance line family.

Electrical Characteristics

● Parameter conditions

Everything is measured in relation to VSS unless otherwise stated.

● Minimum and Maximum Values

Except for when stated, the minimum and maximum values are guaranteed under the most extreme conditions of ambient temperature, supply voltage, and frequency by tests conducted during manufacture on one hundred percent of the devices with the ambient temperature set to 25 degrees Celsius and the maximum temperature set to TAmax (given by the selected temperature range). Data given in the table footnotes but not tested in production because they are based on characterization data, design simulation, or technological attributes are not tested. According to the characterization, the minimum and maximum values correspond to sample testing and indicate the mean value plus or minus three times the standard deviation (mean3).

Typical values Unless otherwise noted, typical data are calculated using TA = 25 degrees Celsius and VDD = 3.3 volts (for the voltage range of 2 volts to 3.6 volts). They are just provided as design guidelines, and no testing has been done on them. Characterization of a batch of samples taken from a standard diffusion lot over the whole temperature range is used to calculate typical ADC accuracy values. This ensures that 95% of the devices have an error that is either less than or equal to the value stated (mean2).

Typical Curves

Unless otherwise noted, every typical curve is provided solely for the purpose of serving as a design guide, and none of them have been put through any testing.

Arm® Cortex®-M3 core with embedded Flash and SRAM

The Arm Cortex®-M3 CPU is Arm’s most recent series of embedded systems processors. With fewer pins and lower power consumption, it’s ideal for MCU implementation, and it also boasts impressive computational performance and cutting-edge responsiveness to interrupts. Due to its great code efficiency, the Arm Cortex®-M3 32-bit RISC processor can provide the high performance associated with Arm cores in the same memory size as 8- and 16-bit devices. Each member of the STM32F103xC, STM32F103xD, and STM32F103xE performance line family features an Arm core and is compatible with all Arm development environments and software.

Conclusion

“The STM32F103VDT6 will help you advance your programming skills for microcontrollers. This microcontroller can fulfill your exacting requirements because of its broad working temperature range, high clock speed, and sophisticated features, including 12-bit ADC and DAC resolution.

In addition, the STM32F103VDT6 is equipped with 384 KB of flash program memory and a 32-bit CPU based on the potent ARM Cortex M3 core architecture, making it capable of handling even the most challenging tasks. Why then wait? Get ready to enjoy an electronic system that is safer and more effective by placing an order right away from ICRFQ, the leading distributor of electronic components in China!”

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