Part Number: XC3S50AN-4TQG144C

Manufacturer: Xilinx

Description: FPGA – Field Programmable Gate Array Connect EBOM

Shipped from: Shenzhen/HK Warehouse

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Technical Specifications of XC3S50AN-4TQG144C

Datasheet  XC3S50AN-4TQG144C datasheet
Category Integrated Circuits (ICs)
Family Embedded – FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx Inc.
Series Spartan?-3AN
Part Status Active
Number of LABs/CLBs 176
Number of Logic Elements/Cells 1584
Total RAM Bits 55296
Number of I/O 108
Number of Gates 50000
Voltage – Supply 1.14 V ~ 1.26 V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20×20)

XC3S50AN-4TQG144C Description

Spartan®-3AN FPGAs is a game-changing solution that combines low-cost FPGA and nonvolatile technologies. These FPGAs belong to the same family as the Spartan-3A FPGAs, which are known for their dependability and rich set of features, as well as the Spartan-3A DSP FPGAs, which are known for their increased density. The Spartan-3AN FPGA family’s small size makes it well-suited for use in blade servers, medical equipment, automobile entertainment, telematics, GPS, and other small consumer items.

To improve system reliability, FPGA and Flash technology are combined. This minimizes the number of chips required, the number of PCB traces, and the size of the system as a whole. The Spartan-3AN FPGA is the first nonvolatile FPGA to have MultiBoot, enabling two or more configuration files within a single device to accommodate field upgrades, test modes, or different system configurations. Security is built into the design of the internal configuration interface, and full support for external configuration is still available.

Features Description

  • The Spartan-3A chip is now the gold standard for low-priced, nonvolatile FPGA solutions. Its cutting-edge 90 nm device feature set, which includes SelectIO, memory, DCMs,  hot swap, multipliers, and power management, removes the common restrictions of nonvolatile FPGAs.
  • The Spartan-3A reduces design complexity and saves board real estate thanks to its onboard, highly reliable configuration memory. This means fewer support issues and, perhaps, 11+ Mb of user-accessible nonvolatile memory.
  • The device includes code shadowing, embedded processing, Multiboot compatibility, and its dependable 100K Flash memory program or erases cycles and 20-year data retention.
  • Bitstream anti-cloning protection, a hidden configuration interface, a Device DNA serial number in each device for design authentication, protection and lockdown of flash memory sectors, and automatic recovery from configuration errors are only some of the security measures included in the Spartan-3A.
  • The device has a suspend mode that allows it to conserve power without losing any of the design state or FPGA configuration data, and it can wake up from this state in less than 100 ms.
  • This device offers a large number of flexible logic resources, including a maximum density of 25,344 logic cells, the availability of shift registers or distributed RAM, enhanced 18 x 18 multipliers with an optional pipeline, and a hierarchical SelectRAM memory architecture that supports up to 576 Kbits of block RAM and up to 176 Kbits of dedicated distributed RAM.
  • Additionally, there is plenty of low-skew routing and up to eight Digital Clock Managers (DCMs), eight global clocks, and eight extra clocks for each side of the device. With MicroBlaze and PicoBlaze embedded processing cores and full support for 32/64-bit 33 MHz PCI technology, the Spartan-3A is compatible with the whole Xilinx ISE and WebPACK software development environment.

Architectural Overview

The Spartan-3AN and Spartan-3A FPGAs share the same architecture. There are five basic programmable functional components in the architecture:

  • Flexible Look-Up Tables (LUTs) that implement logic are included in Configurable Logic Blocks (CLBs) and storage components employed as flip-flops or latches.
  • I/O blocks (also known as IOBs) regulate the data flow between the device’s internal circuitry and the I/O pins. IOBs offer 3-state operation and bidirectional data transfer. Many distinct signal standards, including numerous high-performance differential standards, are supported by them. There are also Double Data-Rate (DDR) registers.
  • Data storage is done using 18-Kbit dual-port blocks in block RAM.
  • Multiplier Blocks compute the product from two 18-bit binary values as inputs.
  • The self-calibrating, entirely digital Digital Clock Manager (DCM) Blocks offer solutions for distributing, delaying, multiplying, splitting, and phase-shifting clock signals.
  • A dual ring of staggered IOBs surrounds a normal array of CLBs. Except for the XC3S50AN, which only has one column, all devices have two columns of block RAM. Multiple 18-Kbit RAM blocks make up each RAM column. Each RAM block has a unique multiplier attached to it. Two DCMs are located at the top of the device and two at the bottom.
  • DCMs are only present at the top of the XC3S50AN, while two DCMs are added in the center of the two columns of block RAM and multipliers in the XC3S700AN and XC3S1400AN. The Spartan-3AN FPGA has a robust trace network that connects all five functional parts and transmits signals between them. A switch matrix for each functional component enables numerous connections to the routing.


The functional elements and routing resources in a Spartan-3AN FPGA are collectively controlled by a set of resilient, reprogrammable, static CMOS configuration latches (CCLs). The FPGA’s settings are kept in nonvolatile memory, either on-chip in Flash or in an external nonvolatile medium like a PROM, which can be located anywhere on or off the board. The FPGA’s configuration data is then written in one of seven modes when power is applied.

  • From internal SPI Flash memory, configure.
  • Completely independent.
  • Smaller board size.
  • user-friendly configuration interface
  • Flash PROM from a Xilinx Platform, Master Serial.
  • An external SPI serial flash device that adheres to industry standards.
  • Usually downloaded from a processor, slave serial.

The MultiBoot function allows various configuration files to be kept in the on-chip Flash, allowing for field upgrades and longer service life. To reduce stock and make it easier to implement new features in the field, MultiBoot allows for different system solutions on a single board. With the external configuration technique, you still have the freedom to experiment with different MultiBoot setups.

Security standards for electronic devices have recently increased in response to widespread design copying, unapproved overproduction, and total reverse engineering. By authenticating the design, the security is upgraded from bitstream protection to the next level of design-level security, which safeguards the design and the embedded microcode. In this case, the user defines the authentication algorithm and implements it in FPGA logic. Each product iteration, generation, or design might use a unique algorithm and features to bolster safety.


The XC3S50AN-4TQG144C is an extremely competent and flexible FPGA solution that provides various advanced features and performance enhancements over conventional FPGAs. The XC3S50AN-4TQG144C is well suited to many applications thanks to its generous nonvolatile memory, versatile I/O options, efficient logic resources, and full design help from Xilinx’s ISE and WebPACK tools. Additionally, those looking for a powerful FPGA solution will find it a secure and affordable choice because of its low cost and strong security features. Contact ICRFQ, a reputable Chinese distributor of electronic components, right away to find out more or to place an order!

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