MX25L1606EM2I-12G
Part Number: MX25L1606EM2I-12G
Manufacturer: Macronix
Description: IC FLASH 16MBIT SPI 86MHZ 8SOP
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Introduction
The MX25L1606EM2I-12G is a Flash NOR memory IC with a maximum speed of 86 MHz and the ability to store 16 megabits (2 megabytes). It is used in many electronic products that need non-volatile storage because it is small and has an SPI interface. This detailed guide is meant to give you an overview of the MX25L1606EM2I-12G by describing its most important features, specifications, and typical uses.
Introduction to the MX25L1606EM2I-12G
Macronix makes the MX25L1606EM2I-12G. It is a Flash NOR memory IC. It is made to let a wide range of electronic gadgets store information that doesn’t change when the power goes out. With 16 megabits (2 megabytes) of storage space, it is a reliable and efficient way to store computer code, configuration data, and other important data.
The Serial Peripheral Interface (SPI) is used by the MX25L1606EM2I-12G to talk to the main microcontroller or system. Since many microcontrollers and other devices support the SPI interface, this makes it easy to add to different apps.
Key Features
The MX25L1606EM2I-12G has a number of important features that make it a good choice for a wide range of memory storage needs. Some of the things that stand out are:
● 16Mbit Capacity
The IC has a storage capacity of 16 megabits, which is equal to 2 megabytes. This makes it possible to store a lot of data, such as computer code, configuration settings, and other important data.
● SPI Interface
The famous Serial Peripheral Interface (SPI) is used to talk to the MX25L1606EM2I-12G. The SPI interface makes it easy to connect microcontrollers and other devices and send data quickly.
● High-Speed Operation
It has a maximum working frequency of 86 MHz, which means it can read and write data quickly and efficiently.
● Low Power Consumption
The IC is made to work with little power, so it can be used in battery-powered devices or uses that have strict power needs.
● Wide Temperature Range
The MX25L1606EM2I-12G works successfully in a wide range of temperatures, usually from -40°C to +85°C, so it can be used in a variety of places and situations.
● Industry-Standard Package
The IC comes in an 8-SOP (Small Outline box), which is a small and common box type that makes it easy to add to different circuit designs.
Functional Description
- Read Operation: The MX25L1606EM2I-12G can do fast-read operations, which makes it easy to get info quickly. Most of the time, the following steps are taken to read data from memory:
- Choose the thing: Set the Chip Select (/CS) pin low to allow contact with the device.
- Give the order to read: Use the Serial Data Input (SI) pin to send the right read command to the device. With the command, the device is told to start the reading process.
- Address the spot in memory: Send the memory address you want to indicate where the data should be read from. The address is sent one at a time through the SI pin.
- Read data: After getting the address, the device starts sending out the data from the memory spot that was told to it. Through the Serial Data Output (SO) pin, the data comes in.
- Keep reading or turn off the device: If more data needs to be read, the address and read steps need to be done again. Once the data you want has been received, set the Chip Select (/CS) pin to high to stop reading from the device.
Write Operation
Both byte and page write tasks can be done on the MX25L1606EM2I-12G, so data can be written to specific memory locations. Here is a broad description of the write operation:
- Choose the thing: Set the Chip Select (/CS) pin low to allow contact with the device.
- Give the command to allow writing: Send the device the right command through the Serial Data Input (SI) pin to tell it to allow write activities.
- Address the spot in memory: Send the address of the target memory through the SI pin to tell the computer where to write the data.
- Provide the data: Use the SI pin to send the data to be written to the memory spot that has been chosen.
- Finish the writing process: When the gadget gets the data, it writes it to the address that was given. The write process usually finishes within a certain amount of time, which is written in the datasheet. After the write process is done, the device is ready for the next step.
Erase Operation
To delete data from memory, the MX25L1606EM2I-12G offers chip or sector wipe operations. Larger blocks of erasure are used to maximize efficiency. The following are the erase operations:
- Choose the gadget: To allow the device to communicate, lower the Chip Select (/CS) pin.
- Give the command “write enable” To enable write operations, provide the proper command through the SI pin.
- Address the chip or sector: To erase a specific area of memory, send the erase command along with the target sector or chip address over the SI pin.
- Start the erase process: Upon receiving the erase command and address, the device begins the wipe procedure. The datasheet can be used to determine the wipe operation’s duration, which changes according to the instruction.
- Wait for the erase procedure to finish: After starting the erase operation, it is crucial to hold off on taking any further action until the operation has finished. By employing the right commands and status registers, the state of the wipe process may be kept track of.
Protection Mechanisms
Several security features are built into the MX25L1606EM2I-12G to protect data integrity and stop unintentional changes. Among these mechanisms are:
Write Protect (/WP) Pin
Write operations to the memory can be stopped, protecting it from unintentional writes, by holding the /WP pin at a low voltage. The host controller or system can manage write protection by controlling this pin.
Software Write Protection
The device may offer software-based write protection methods that allow for the read-only designation of particular memory sectors or regions. Usually, this protection is managed by means of a set of commands or configuration registers.
Lock Bits: Some MX25L1606EM2I-12G variations may have lock bits that can be configured to permanently shield some memory areas from editing or erasing. A higher level of data security is provided by the inability to modify or erase these zones once they have been locked.
The individual commands, addresses, and protection measures offered by the MX25L1606EM2I-12G should be thoroughly reviewed in the device datasheet because they may change based on the precise device model.
Conclusion
Experience reliable and efficient non-volatile storage with the MX25L1606EM2I-12G Flash NOR memory IC. It offers capacity, speed, and interface compatibility for diverse applications. With low power consumption, a wide temperature range, and built-in protection mechanisms, it adapts to any environment. Unlock your project’s potential—order the MX25L1606EM2I-12G from ICRFQ today.