STM32F103RET6 IC

Technical Specifications of STM32F103RET6

Datasheet	STM32F103RET6 datasheet
Category	Integrated Circuits (ICs)
Family	Embedded – Microcontrollers
Manufacturer	STMicroelectronics
Series	STM32 F1
Packaging	Tray
Part Status	Active
Core Processor	ARM? Cortex?-M3
Core Size	32-Bit
Speed	72MHz
Connectivity	CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
Peripherals	DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O	51
Program Memory Size	512KB (512K x 8)
Program Memory Type	FLASH
EEPROM Size	–
RAM Size	64K x 8
Voltage – Supply (Vcc/Vdd)	2 V ~ 3.6 V
Data Converters	A/D 16x12b; D/A 2x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	64-LQFP
Supplier Device Package	*

STM32F103RET6 Description

The STM32F103xE, STM32F103xC, and STM32F103xD performance line family includes a high-performance Arm® Cortex®-M3 RISC core operating at 72 MHz, high-speed embedded memories, two APB buses for interconnecting a wide range of high-performance I/Os and peripherals, and so on. The devices include up to three 12-bit Decoders, 4 general-purpose 16-bit timers, 2 I2Cs,  2 PWM timers, 3 SPIs, 1 SDIO, 5 USARTs, and a CAN.

The STM32F103xC/D/E high-density performance line family operates between -40 and +105 °C and from a power supply range of 2.0 to 3.6 V. A strong power-saving mode enables the creation of low-power apps. The STM32F103xC/D/E family of high-density, performance-line microcontrollers can be used for various purposes, including motor drives, medical and handheld devices, gaming peripherals, PLCs, industrial applications, scanners, inverters, GPS platforms, printers, alarm systems, HVAC and, video intercom.

● Absolute Balance in The Family

Regarding software and functionalities, every component in the STM32F103xC/D/E family is fully backwards compatible with every other component. The reference manual classifies the STM32F103x4, STM32F103x6, STM32F103x8, and STM32F103xB as low-density devices while classifying the STM32F103xC, STM32F103xD, and STM32F103xE as medium-density, high-performance devices. The low-density and high-density devices that are extensions of the medium-density STM32F103x8/B devices are described in full in the datasheets for the STM32F103x4/6 and STM32F103xC/D/E. Timers, peripherals, Flash memory, and RAM are all reduced in low-density devices.

Although high-density devices have more RAM, Flash memory, and peripherals like SDIO, FSMC, I2S, and DAC, they are perfectly compatible with the rest of the family. The STM32F103x4, STM32F1036, STM32F103xC, STM32F103xD, and STM32F103xE are drop-in replacements for the STM32F103x8/B devices and offer the developer greater options for memory configurations and iteration speed. There is also complete backward compatibility between the STM32F103xx performance line family, the STM32F101xx access line family, and the STM32F102xx USB access line family.

● Arm Cortex-M3-based core with on-board Flash and SRAM

Arm’s newest CPU lineup, the Cortex®-M3 family, is designed to power embedded systems. The project’s objective was to design a low-cost platform that could be used to implement low-power microcontrollers that yet provided excellent computational performance and a nuanced response to interrupts. The Arm Cortex®-M3 32-bit RISC processor’s high code efficiency enables it to deliver Arm cores’ outstanding performance while using the same amount of memory as 8- and 16-bit devices. Due to the incorporated Arm core, the STM32F103xC, STM32F103xD, and STM32F103xE performance line family is completely compatible with all Arm tools and software.

Flash memory that is built-in Up to 512 KB of internal Flash memory can be used to store programs and data.

● The cyclic redundancy check’s calculating unit

The CRC (cyclic redundancy check) calculation unit uses a 32-bit data word and a fixed-generating polynomial to create a CRC code. CRC-based methods are helpful for various tasks, such as ensuring data integrity during transmission or storage. They offer a technique for examining Flash memory’s integrity while staying within the confines of the EN/IEC 60335-1 standard. A software signature is formed at runtime with the help of the CRC calculation unit, which is then compared to a reference signature made at link time and kept in a designated memory location.

● With a parallel port and LCD

The interface of the FSMC can be modified to function with a wide range of graphical LCD controllers. It is adaptable enough to work with various LCD interfaces and supports Motorola 6800 and Intel 8080 modes. It is straightforward to develop high-performance solutions using external controllers that offer specialised acceleration or economic ones using LCD modules that come with embedded controllers using the LCD parallel interface.

● The controller for external events and interrupts (EXTI)

The external interrupt/event controller uses 19 edge detector lines to start interrupt/event requests. Each line can be individually masked and programmed to trigger on its own rising or falling edge. A waiting register keeps track of the interrupt requests. The EXTI will notice if the external line’s pulse width exceeds the internal APB2 clock’s period. With the 16 external interrupt lines, 112 GPIOs can be connected.

● Keeping time and Turning on

The system clock is selected during boot, and the internal RC 8 MHz oscillator is used during reset. An external 4-16 MHz clock can be used; its condition is monitored in this case. The system will switch back to the internal RC oscillator when a problem is discovered. A software interruption will be produced if it is engaged. Similar to the PLL clock entry, interruptions can be fully handled if necessary (for example, with the failure of an indirectly used external oscillator). Various prescalers can be used to establish the AHB frequency, the high-speed APB (APB2) domain, and the low-speed APB (APB1) domain. The maximum frequency in the low-speed AHB and high-speed APB areas is 72 MHz.

● Temperature Detector

The voltage the temperature sensor generates must match the desired temperature. The input voltage range is from 2 V to VDDA, or 3.6 V. The ADC1 IN16 input channel is directly connected to the output voltage of the temperature sensor’s analogue-to-digital conversion.

● JTAG serial cable debugging connector (SWJ-DP)

The embedded Arm SWJ-DP Interface, a JTAG and serial wire debug interface combined, allows the target to be linked to either a JTAG probe or a serial wire debug probe. The TMS pin, shared with SWDIO and SWCLK, must be configured in a certain order to switch between JTAG-DP and SW-DP.

Conclusion

In conclusion, the STM32F103RET6 microcontroller from STMicroelectronics is a versatile and powerful device that can simplify circuit design and speed up simple tasks. Its wide temperature range and voltage tolerance make it suitable for various applications, and its 32-bit processor and ARM Cortex M3 core architecture provide plenty of processing power. With a flash program memory of 512KB and a maximum clock speed of 72 MHz, this microcontroller is well-suited for a range of embedded systems projects.

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