Part Number: TBD62783AFG

Manufacturer: Toshiba Semiconductor and Storage

Description: IC PWR SWITCH P-CHAN 1:1 18SOP

Shipped from: Shenzhen/HK Warehouse

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Technical Specifications of TBD62783AFG

Datasheet  TBD62783AFG datasheet
Category Integrated Circuits (ICs)
Family PMIC – Power Distribution Switches, Load Drivers
Manufacturer Toshiba Semiconductor and Storage
Packaging Tube
Part Status Coming Soon
Switch Type General Purpose
Number of Outputs 8
Ratio – Input:Output 1:1
Output Configuration High Side
Output Type N-Channel
Interface On/Off
Voltage – Load 50V (Max)
Voltage – Supply (Vcc/Vdd) Not Required
Current – Output (Max) 500mA
Rds On (Typ)
Input Type Non-Inverting
Fault Protection
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 18-SOIC (0.276″, 7.00mm Width)
Supplier Device Package 18-SOP

TBD62783AFG Introduction

The DMOS transistor array known as the TBD62783A series contains 8 different circuits. Each output is equipped with a clamp diode that can switch inductive loads. This feature is built into the device. During the course of use, please be mindful of the temperature conditions.

TBD62783AFG Features

  • 8 circuits built-in.
  • High voltage.
  • High current.

TBD62783AFG Specifications

A 960mW maximum power dissipation and 1.5mA maximum supply current characterize the TBD62783AFG, an active DMOS transistor array. It can run on an input voltage between 2V and 25V and is optimized for driving high-current loads. The gadget has a maximum operating voltage of 50V and complies with EU RoHS standards.

The gadget comes in a surface mount package with 18 pins; its dimensions are 2 mm in height, 7 mm in width, and 13 mm at its longest point. A third-party vendor provides the SOP.

The TBD62783AFG may be used between temperatures as low as -40 degrees Celsius and as high as 85 degrees Celsius, and it can be stored between -55 degrees Celsius and 150 degrees Celsius. The PCB change for this device is 18. It is PCB mountable.

To sum up, the TBD62783AFG is an active DMOS Transistor Array that can handle high-current loads. It accepts an input voltage between 2V and 25V and complies with EU RoHS regulations. It can be attached to a printed circuit board and handle up to 50 V power. The maximum length of its packaging is 13mm, while its height is 2mm and breadth is 7mm. The device has reached an operational state.

Precautions for Using

This IC has no built-in protective circuits for excessive current or voltage. As a result, if there is a short circuit between two outputs or adjacent pins, a short to power fault, or a short-to-ground fault, the IC will be destroyed if the current or voltage exceeds the IC’s absolute maximum rating. Please remember to design with enough power supply, output, and GND lines. Please install the proper fuse in the power supply line so that the current does not continue to flow above the IC’s absolute maximum rating.

IC Usage Considerations

● Notes on the handling of ICs

An absolute maximum must never be exceeded by a semiconductor device, ever be surpassed. Don’t go overboard on any of the limits. Failure, damage, or degeneration of the device and possible injury from explosion or combustion might arise from exceeding the rating(s).

Do not install devices upside down or backward. Double-check that the power supply’s positive and negative terminals are securely connected. If you push it too far, the device could blow up or catch fire, injuring you or, at the very least, causing the electricity to flow faster than it was designed. Never use a device with current supplied to it in the wrong direction or placed in the wrong orientation.

Be sure that in the event of overcurrent and/or IC failure, a significant current does not continually flow by using a suitable fuse in the power supply. If the IC is subjected to conditions beyond its absolute maximum ratings, if the wiring is routed poorly, or if anomalous pulse noise develops from the wiring or load, a huge current will flow continually, and the IC will eventually break down. Fuse capacity, fusing time, and the placement of the insertion circuit is only a few of the variables that must be adjusted such that the flow of a big current during a breakdown has as little impact as possible.

Incorporate a protection circuit into your design if you plan on using an inductive load, like a motor coil, to safeguard against device failure due to the positive current caused by the inrush current when the power is turned on or the negative current caused by the back electromotive force when the power is turned off. If an IC fails, it could lead to injuries, smoke, or fire. Make use of a regulated power supply and ICs that provide safety features. Unstable power sources can lead to IC failure because its protection functions won’t activate. IC failure can lead to burns, smoke, and even fire.

For example, when picking a power amplifier and a regulator, make sure to carefully consider the components that will be connected to it from the outside (such as inputs and negative feedback capacitors) and the components that will be used as load (such as speakers). The DC voltage at the IC’s output will increase if there is a lot of leakage current, for example, from the input or the negative feedback condenser. Connecting this output voltage to a speaker with a low input withstand voltage could result in smoke or ignition due to overcurrent or an IC failing. (The IC itself could potentially produce smoke or catch fire due to the excessive current.) In particular, be wary of employing a Bridge Tied Load connection-type IC, which supplies direct DC voltage to a speaker.

Points to remember on the handling of ICs

● Heat Radiation Design

If you need to use an integrated circuit (IC) that handles a lot of current, like a power amplifier, regulator, or driver, you should ensure the device is designed to dissipate heat properly so that the junction temperature (TJ) never becomes too high. Even under normal conditions of use, these ICs will emit heat. Reduced IC lifespan, degraded IC properties, or complete IC failure can result from a heat radiation design that isn’t up to snuff. Also, think about how the heat from the IC will affect the rest of the gadget as you draw out the plans.

● Back-EMF

Inductive back-EMF causes are current to flow back to the motor’s power source when the motor abruptly reverses direction, stops, or slows down. The motor power supply and output pins could be subjected to situations exceeding their absolute maximum ratings if the power supply’s current sink capability is low. To prevent this issue, designers should consider back-EMF’s potential impact.


The TBD62783A series of 8-circuit DMOS transistor arrays, including the active TBD62783AFG, is a variation that can switch inductive loads and provides high voltage and current capabilities thanks to an integrated clamp diode. It is a flexible choice for high-current load driving applications because of its EU RoHS compliance and wide input voltage range of 2V to 25V. Even so, it’s crucial to exercise caution regarding temperature while employing.

Its surface mount packaging and PCB installation simplicity makes the TBD62783AFG a great design option. At ICRFQ, we understand the importance of using high-quality electronic components to achieve your project goals. Our team of experts is always ready to assist you in finding the best solutions for your projects. Contact us today to learn more about this product or any other electronic component you need. Let us help you bring your projects to life. Place your order for the TBD62783AFG today and take the first step toward success!

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