Part Number: TS3USB30EDGSR

Manufacturer: Texas Instruments

Description: IC USB SWITCH SGL 1X2 10MSOP

Shipped from: Shenzhen/HK Warehouse

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Technical Specifications of TS3USB30EDGSR

Datasheet  TS3USB30EDGSR datasheet
Category Integrated Circuits (ICs)
Family Interface – Analog Switches – Special Purpose
Manufacturer Texas Instruments
Packaging Tape & Reel (TR)
Part Status Active
Applications USB
Multiplexer/Demultiplexer Circuit
Switch Circuit DPDT
Number of Channels 1
On-State Resistance (Max) 10 Ohm
Voltage – Supply, Single (V+) 3 V ~ 4.3 V
Voltage – Supply, Dual (V±)
-3db Bandwidth 900MHz
Features Bi-Directional, USB 2.0
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 10-TFSOP, 10-MSOP (0.118″, 3.00mm Width)
Supplier Device Package 10-VSSOP

TS3USB30EDGSR Description

The TS3USB30E is a high-bandwidth switch made to switch and isolate high-speed USB 2.0 data in systems with few USB I/Os. This switch’s wide bandwidth (900 MHz) lets data pass through with as little edge and phase distortion as possible. Differential outputs from a USB host device can go to one of two matching outputs, or they can go from two different hosts to one matching output. The switch works in both directions and slows down the high-speed signals at the outputs as little as possible, if at all. It is made to have low bit-to-bit skew and high noise isolation between channels. It is also suitable with many standards, such as high-speed USB 2.0 (480 Mbps).

TS3USB30EDGSR Key Features

● Wide Bandwidth (900 MHz)

The TS3USB30EDGSR has a bandwidth of 900 MHz, which is a large amount. This high bandwidth is important because it lets data go through the switch with the least amount of distortion at the edges and in the phase. It makes sure that the integrity of high-speed USB 2.0 information is kept, which keeps the quality of the data being sent.

● Handling High-Speed USB 2.0 Signals

The TS3USB30EDGSR is made to work well with high-speed USB 2.0 signals. It works with the fast data flow rates of USB 2.0, so USB devices can talk to each other without any problems. Even at high speeds, the switch makes sure that signals are routed correctly without changing the quality of the signals.

TS3USB30EDGSR Advantages for Systems with Few USB I/Os

The TS3USB30EDGSR has a number of advantages for systems with few USB I/Os:

● Signal Switching

It lets a limited number of USB I/Os be shared by a number of USB devices. The switch lets you choose between different USB devices, so you can connect them to the machine as needed. This trait makes the system more flexible and easier to use.

● Signal Isolation

The TS3USB30EDGSR has signal separation, which lets the system keep sensitive components or circuits away from USB devices that could cause electrical problems or ground loops. It keeps signals from getting in each other’s way, making sure the system works well and reliably.

● Space and Cost Savings

If you only have a few USB I/Os, using the TS3USB30EDGSR means you don’t need any more USB devices or ports. This saves valuable board room and lowers system costs by getting rid of USB parts that aren’t needed.

● Simplified System Design

The switch makes the design of the whole system easier by making it easier to manage USB connections and offering a simple answer for systems with few USB I/Os. It provides a small and efficient way to handle USB data, which makes designs simpler and improves the overall performance of the system.

Overall, the TS3USB30EDGSR is a great choice for applications that need to route and isolate USB signals efficiently. It has a wide bandwidth, can handle high-speed USB 2.0 signals, and helps systems with few USB I/Os.

TS3USB30EDGSR Applications

  • Routes Signals for USB 1.0, 1.1, and 2.0.
  • Multi-Purpose Signal Switching.
  • Portable Electronics.
  • Consumer Products

Power Supply Recommendations

To meet USB 1.1, 1.0, and 2.0 standards, it is crucial to provide the TS3USB30EDGSR with proper power through the VCC pin. Texas Instruments recommends changing a bypass capacitor close to the VCC pin to minimize low-frequency noise and enhance load regulation across the frequency range. This ensures a stable power supply and improved signal integrity.


● Layout Guidelines

Power bypass capacitors should be placed as close as possible to the VCC pin and not near the D+ and D– lines. The high-speed D+ and D– lines should always be the same length, and they shouldn’t be more than 4 inches long. If they are longer than that, the eye map might not work as well. A high-speed USB link is made with a shielded, twisted-pair wire with a differential characteristic impedance. For the best results, the D+ and D– traces on the layout should have the same impedance as the wire.

To send the high-speed USB signals, use as few vias and corners as possible. This will cut down on signal returns and impedance changes. If you have to use a via, make the space around it bigger to make it less capacitance. Each via breaks up the signal’s line of contact and makes it more likely that the signal will pick up noise from the other layers of the board. Be careful when making test points on bent pair lines. Using pins with through-holes is not a good idea. When you need to turn 90°, make two 45° turns or a circle instead of a single 90° turn.

This keeps the impedance from breaking up as much, which reduces the number of reflections on the signal lines. Do not put USB lines under or near clock signal generators, crystals, oscillators, switching regulators, magnetic devices, mounting holes, or ICs that use or copy clock signals. Stubs produce signal echoes on high-speed USB transmissions. If a stub is needed, it should be less than 200 mm long. All high-speed USB data should be sent on a single, uninterrupted plane (VCC or GND). Try not to cross anti-etch, which is often found where planes split.

Because USB uses high frequencies, a printed circuit board needs at least four layers: two data layers, a ground layer, a power layer, and a power layer. Signal 1 should have most signal lines. The GND plane should be placed directly next to this layer, which is solid and has no cuts. Don’t put signal lines where the power or ground plane is broken. When you have to run across two separate planes, you need to give yourself enough space. At high frequencies, EMI can be cut down by reducing the number of signals vias.


The TS3USB30EDGSR is a single device for routing and isolating high-speed USB data in systems with few USB I/Os. Its ability to work with high-speed USB 2.0, have a large bandwidth, and save room make system design easier and improve overall performance. It is an important part of a USB link that stays connected and works well. Contact ICRFQ, China’s biggest distributor of electronic parts, to find out more about the TS3USB30EDGSR and to buy it.

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